外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8067-1 | HWSON8 | plastic thermal enhanced very very thin Small Outline packages, no leads; 8 terminals; 0.5 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | MO-229 (JEDEC) | 2023-08-21 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT8067-1 | plastic thermal enhanced very very thin Small Outline packages, no leads; 8 terminals;0.5 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | Package information | 2025-06-10 |
| SOT8067-1_147 | HWSON8; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-02-01 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|