外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8041D-1 | HWQFN24 | plastic thermal enhanced very very thin Quad Flat package with side-wettable flanks, no leads; 24 terminals; 0.5mm pitch; 4.0mm x 4.0mm x 0.75mm body | 2025-02-10 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT8041D-1 | plastic thermal enhanced very very thin Quad Flat package with side-wettable flanks, no leads; 24 terminals; 0.5mm pitch; 4.0mm x 4.0mm x 0.75mm body | Package information | 2025-06-17 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| NEX5310000BY-Q100 | Dual-port USB Type-C and Power Delivery controller |