外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8109-1 | HWQFN16 | Plastic thermal enhanced very very thin Quad Flat package; no leads; 16 terminals; 0.65 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | MO-220 (JEDEC) | 2024-12-18 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT8109-1 | Plastic thermal enhanced very very thin Quad Flat package;no leads; 16 terminals; 0.65 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | Package information | 2025-03-18 |
| SOT8109-1_518 | HWQFN16; Reel dry pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-01-27 |
采用此封裝的產(chǎn)品
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| 型號(hào) | 描述 | 快速訪問 |
|---|---|---|
| NEX5204100BV | USB Type-C? and Power Delivery controller |